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MEMS Scanner

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  Micro-electro-mechanical systems (MEMS) technology, which initially stems from semiconductor micro-fabrication, enables the creation of micro-optical elements, such as MEMS scanners. Made from silicon material, which has good electrical and mechanical properties, Korea Optron Corporation (KOC) MEMS scanners feature a reflective mirror, torsional springs, and electrical paths. The mirror redirects incident beam toward specific direction where users want to scan the target object. The incident beam is usually laser, but other kinds of light sources can also be used.

  The torsional springs, which connect the mirror with frame anchors, makes the mirror to rotate at specific angles. For two-axis scanner, the mirror can rotate in two dimensional ways around torsional springs, which are placed in orthogonal direction on each axis. The electrical signal is the main source that generates forces to rotate themirror. 

 

 

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Packaged MEMS Scanner​

• Anti-Reflection (AR) Coated  High Efficiency Windows
• MEMS scanner chip
• Leadless Chip Carrier (LCC)

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No. Target
Specification
unit Type 1 Type 2
(commercializing test)
Type 3
(commercializing test)
1 Chip size
(W x H)
mm 5 x 5 8 x 8 6 x 6
2 Mirror size mm 1 3 2.3 x 3
3 Scan axis 2 2 2
4 Scan speed
Fast-axis Hz 2000
Resonance operation
Max. 100 Hz
Static/quasistatic operation
2000
Resonance operation
Slow-axis Hz 60
Static/quasistatic operation
Max. 100 Hz
Static/quasistatic operation
20
Static/quasistatic operation
5 Optical scan angle
Fast-axis deg. ≥ ±12 ≥ ±5 ≥ ±5
Slow-axis deg. ≥ ±4 ≥ ±5 ≥ ±5